Fully automated in-line OCD and dimensional shape metrology system (IZM-133.3) - PR1320279-3460-P

1x Fully automated in-line OCD and dimensional shape metrology system (IZM-133.3) The following equipment specification defines the requirements for a fully automated metrology tool to measure critical dimension (CD) structures, film thickness and Cu dishing on 300 mm and 200 mm wafers. This investment expands the metrology capability for automated, non-destructive measurement of smaller feature sizes and surface topography. The tool is essential for process control in advanced packaging and interconnect fabrication, including post-CMP characterization of Cu structures with sub-micrometer feature sizes in highly integrated, chiplet-based 2.5D/3D and quasi-monolithic package architectures. The equipment is compatible with 3D wafer stacks exhibiting high warp/bow. Wafer substrates are silicon and/or glass, with thicknesses up to 2.5 mm. Before processing, wafers are delivered to the tool in front-opening unified pods (FOUPs), which the operator manually places on the respective load ports. The new tool must be able to perform the following sequence of steps fully automatically: - Load designated wafers from the FOUP(s) - Execute metrology tasks - Return wafers to their original positions in the FOUP(s) Recipe programming must support a sufficiently wide range of options and parameters to meet research and development (R&D) needs. It is required that the equipment continuously performs the intended functions without interruptions or failures, in accordance with all requirements specified in this document. Furthermore, the equipment must be supplied with all items described below that are necessary for it to deliver the intended functions and capabilities in compliance with all requirements set out in this document.