Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers

IHP GmbH - Lebniz-Institut für innovative Mikroelektronik

Germany

28 Oct 2026

Description

Description of the Procurement - Type and Scope of Supplies / Requirements The procurement comprises the supply of a complete semi-automatic wafer prober system for the electrical and RF characterization of 200-mm wafers for research and laboratory applications at IHP. The scope of supply includes, in particular, a semi-automatic 200-mm wafer prober with vacuum chuck, precision XY/Z/Theta positioning, shielded prober chamber, six individual electrical probes, two multi-contact probe holders suitable for RF measurements up to at least 6 GHz, and a probe card adapter. The system shall also include an automated microscope, color and side-view cameras, control PC, hardware control panel, control software, required cables, interfaces, power supplies and replacement probes. The system shall support DC, pulsed I-V and low-frequency impedance measurements up to at least 10 MHz as well as RF characterization. All components shall be technically compatible and capable of being operated as an integrated system. The procurement further includes complete delivery, transport, installation, configuration, commissioning, functional testing, on-site training and provision of all required technical, operating and safety documentation. The supplier shall also provide warranty, service and spare-parts/consumables availability for the specified warranty period. The system must comply with the specified mechanical, electrical, safety, EMC, CE, IT and environmental requirements and be suitable for integration into the existing IHP laboratory and IT infrastructure.

The record

As published. The notice text stays with the publisher.

Country

Germany

Regions (NUTS)

Frankfurt (Oder)

Category

Laboratory, optical and precision equipments (excl. glasses) · Laboratory, optical and precision equipment38540000

Deadline

28 Oct 2026

Published

28 Sept 2026

Languages

Deutsch (German)

Source

TED (EU) · 670077-2026

How to bid

Procedure

Open - anyone may submit a tender

Submit your tender at

https://vergabemarktplatz.brandenburg.de/VMPSatellite/notice/CXSTYYDDYRW8N6CR

Submission language

DEU

Electronic submission

Required

Tender documents

Freely available

Contract terms

Type of contract

Supplies

Place of performance

DE403

Your tender must stay valid for

60 days

Framework agreement

No

Dynamic purchasing system

No

Variant tenders

Not allowed

EU funded

No

Contact the buyer

Email

vergabestelle@ihp-microelectronics.com

Phone

+49 33525309

Address

Im Technologiepark 25, 15236, Frankfurt (Oder)

Contact point

Beschaffung

Can your company bid for this?

Paste a website. We read what the company does and score it against this tender. No account.

Open tenders like this one

Ranked by what the notices are about, not by matching words in the title.

Notice data is reused from official sources: Tenders Electronic Daily (TED), published by the Publications Office of the European Union under Commission Decision 2011/833/EU; oeffentlichevergabe.de and TenderNed, published under CC0. Each notice links to the original, which is the version that governs.

See only the ones that fit your company

Notices like this one open every week. A profile puts the ones your company can win in front of you, scored, with a line explaining each match.

Start free