Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers
TED (EU)
IHP GmbH - Lebniz-Institut für innovative Mikroelektronik
Germany
28 Oct 2026
Description
Description of the Procurement - Type and Scope of Supplies / Requirements The procurement comprises the supply of a complete semi-automatic wafer prober system for the electrical and RF characterization of 200-mm wafers for research and laboratory applications at IHP. The scope of supply includes, in particular, a semi-automatic 200-mm wafer prober with vacuum chuck, precision XY/Z/Theta positioning, shielded prober chamber, six individual electrical probes, two multi-contact probe holders suitable for RF measurements up to at least 6 GHz, and a probe card adapter. The system shall also include an automated microscope, color and side-view cameras, control PC, hardware control panel, control software, required cables, interfaces, power supplies and replacement probes. The system shall support DC, pulsed I-V and low-frequency impedance measurements up to at least 10 MHz as well as RF characterization. All components shall be technically compatible and capable of being operated as an integrated system. The procurement further includes complete delivery, transport, installation, configuration, commissioning, functional testing, on-site training and provision of all required technical, operating and safety documentation. The supplier shall also provide warranty, service and spare-parts/consumables availability for the specified warranty period. The system must comply with the specified mechanical, electrical, safety, EMC, CE, IT and environmental requirements and be suitable for integration into the existing IHP laboratory and IT infrastructure.
The record
As published. The notice text stays with the publisher.
Country
Germany
Regions (NUTS)
Category
Laboratory, optical and precision equipments (excl. glasses) · Laboratory, optical and precision equipment38540000
Deadline
28 Oct 2026
Published
28 Sept 2026
Languages
Deutsch (German)
Source
TED (EU) · 670077-2026
How to bid
Procedure
Open - anyone may submit a tender
Submit your tender at
https://vergabemarktplatz.brandenburg.de/VMPSatellite/notice/CXSTYYDDYRW8N6CR
Submission language
DEU
Electronic submission
Required
Tender documents
Freely available
Contract terms
Type of contract
Supplies
Place of performance
DE403
Your tender must stay valid for
60 days
Framework agreement
No
Dynamic purchasing system
No
Variant tenders
Not allowed
EU funded
No
Contact the buyer
vergabestelle@ihp-microelectronics.com
Phone
+49 33525309
Address
Im Technologiepark 25, 15236, Frankfurt (Oder)
Contact point
Beschaffung
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Notice data is reused from official sources: Tenders Electronic Daily (TED), published by the Publications Office of the European Union under Commission Decision 2011/833/EU; oeffentlichevergabe.de and TenderNed, published under CC0. Each notice links to the original, which is the version that governs.
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